
Materials store
Next-generation materials engineered at the atomic scale to drive breakthroughs in microchip innovation.

Monolayer Molybdenum Disulfide (MoS₂) Flakes
With a direct bandgap at the monolayer scale, MoS₂ enables ultra-thin transistors that combine high on/off ratios, excellent electrostatic control, and low power consumption. Its stability and scalability make it a leading candidate for advanced nanoelectronic applications beyond traditional silicon.
Substrate details
Substrate
285nm SiO2/Si substrate
Orientation
<100>
Doping Type
P/Boron
Reistance Range
1-100 ohm-cm
Polish
SSP

Monolayer Molybdenum Disulfide (MoS₂) Film
With a direct bandgap at the monolayer scale, MoS₂ enables ultra-thin transistors that combine high on/off ratios, excellent electrostatic control, and low power consumption. Its stability and scalability make it a leading candidate for advanced nanoelectronic applications beyond traditional silicon.
Substrate details
Substrate
285nm SiO2/Si substrate
Orientation
<100>
Doping Type
P/Boron
Reistance Range
1-100 ohm-cm
Polish
SSP

Monolayer Tungsten Diselenide (WSe₂) Flakes
Unlike MoS₂’s primarily n-type behavior, WSe₂ supports ambipolar transport with a tunable bandgap — ideal for flexible, low-power devices that require both p- and n-type conduction.
Substrate details
Substrate
285nm SiO2/Si substrate
Orientation
<100>
Doping Type
P/Boron
Reistance Range
1-100 ohm-cm
Polish
SSP

Monolayer Tungsten Diselenide (WSe₂) Film
Unlike MoS₂’s primarily n-type behavior, WSe₂ supports ambipolar transport with a tunable bandgap — ideal for flexible, low-power devices that require both p- and n-type conduction.
Substrate details
Substrate
285nm SiO2/Si substrate
Orientation
<100>
Doping Type
P/Boron
Reistance Range
1-100 ohm-cm
Polish
SSP
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